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INSPECTION SYSTEMS

Award winning and patented BGA inspection systems

For more than 15 years over 3,000 users worldwide have benefited the possibility to inspect hidden solder joints in a non destructive way. Whether for inspection under Flip Chips or for inspection where other microscopes are stretched to their limits: ERSASCOPE technology offers significant added value to any Quality Assurance program. Convince yourself of the many advantages of the ERSASCOPE inspection system!

 

Hochflexibles Inspektionsssystem für verdeckte Lötstellen und mehr

ERSASCOPE 2

  • High end endoscope inspection system
    including three quick change heads:
    – 90° BGA head (approx. 280 µm clearance)
    – 90° Flip Chip head (approx. 30 µm clearance)
    – 0° wide angle head, e.g. for VIA inspection without tilting of optics
  • 7 movement axes for flexible adjustment to
    practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality 1.3 megapixel CCD colour camera with USB connection
  • XY rotary table with fine adjust wheels, freely positionable under the optics
  • Optimal light management:
    – inspection heads with fibre optic stereo front light
    – mechanically coupled, swivelling and rotating backlight
    – fibre optic gooseneck for targeted lighting from all sides
    – separate setting of light quantity for all light guides
    – with light brushes, light extension and iris aperture
  • Focusing scale to be used with calibration groups in the
    ImageDoc EXP measuring function
  • Complete set with the most important accessories and storage case

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ERSASCOPE 2XL

  • High-end endoscope inspection system including three quick change heads:
    – 90° BGA head (approx. 280 µm clearance)
    – 90° Flip Chip head (approx. 30 µm clearance)
    – 0° wide angle head, e.g. for VIA inspection without tilting of optics
  • 6 Movement axes for flexible adjustment to
    practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality 1.3 megapixel CCD colour camera with USB connection
  • XY rotary table in XL version with fine adjust wheels, freely positionable under the optics
  • Optics extraction unit for the inspection of front components on particularly deep PCBs
  • Optimal light management:
    – inspection heads with fibre optic stereo front light
    – mechanically coupled, swivelling and rotating backlight
    – fibre optic gooseneck for targeted lighting from all sides
    – separate setting of light quantity for all light guides
    – with light brushes, light extension and iris aperture
  • Focusing scale to be used with calibration groups
    in the ImageDoc EXP measuring function
  • Complete set with the most important accessories and storage case

Hochwertiges Inspektionsssystem für verdeckte Lötstellen und mehr

ERSASCOPE 1

  • Original ERSASCOPE endoscope inspection optics with 90° prism beam deflection (approx. 300 µm clearance)
  • 6 Movement axes for flexible adjustment to practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality WVGA CMOS colour camera with USB connection
  • XY table with fine adjust wheels, freely positionable under the optics
  • Flexible light management:
    – inspection head with fibre optic stereo front light
    – mechanically coupled, swivelling backlight
    – fibre optic gooseneck for targeted lighting from all sies

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ERSA MOBILE SCOPE

  • Mobile inspection system with two quick change lenses (depending on equipment):
    – 90° BGA optics (approx. 280 µm clearance)
    – 0° MACROZOOM top view optics
  • Fast, hand-operated inspection of hidden solder joints
  • Integrated, dimmable LED lighting
  • 2 Megapixel N-MOS colour camera with USB connection
  • Including additional LED fibre light for BGA optics
  • Ideal for inspection of continuously changing locations and for service
  • Including Ersa ImageDoc v3 inspection software (basic version)